Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications-Reference-Cited by-同舟云学术

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Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
language:
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Author:

Lee Bongsub,Katkar Rajesh,Gao Guilian,Fountain Gill,Lee Sangil,Wang Liang,Mandalapu Chandrasekhar,Uzoh Cyprian,Mirkarimi Laura,Sykes Bob,Litjens Max,Niu Yuling,Shao Shuai,Wang Jing,Park Seungbae

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429659.pdf?arnumber=8429659

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition;Micromachines;2024-05-11

2. Accessible determination of die-to-wafer bond strength with the Schwickerath test;Engineering Fracture Mechanics;2020-04

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