Author:
Liu Xingsheng,Xu Shuangyan,Lu Guo-Quan,Dillard David A
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Flip chip technologies;Lau,1995
2. Microelectronics packaging handbook;Tummala,1996
3. Device interconnection technology for advanced thermal conduction modules;Ray;IEEE Trans. Compon. Hybr. Manuf. Technol.,1992
4. Ball grid array technology;Lau,1995
5. Three-dimensional flip-chip on flex packaging for power electronics applications;Liu;IEEE Trans. Adv. Packag.,2001
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献