Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints-Reference-Cited by-同舟云学术

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Strain-rate dependent influence of adherend stiffness on fracture load prediction of BGA solder joints

Published:2017-12 Issue: Volume:186 Page:119-133
ISSN:0013-7944
Container-title:Engineering Fracture Mechanics
language:en
Short-container-title:Engineering Fracture Mechanics

Author:

Nourani Amir,Akbari Saeed,Farrahi Gholamhossein,Spelt Jan K.

Funder

Natural Sciences and Engineering Research Council of Canada

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference19 articles.

1. Adherend thickness influence on fatigue behavior and fatigue failure prediction of adhesively bonded joints;Azari;Compos Part A Appl Sci Manuf,2013

2. Effect of substrate modulus on the fatigue behavior of adhesively bonded joints;Azari;Mater Sci Eng A,2012

3. Comparison of solder joint fracture behavior in Arcan and DCB specimens;Nourani;Eng Fract Mech,2015

4. Effect of geometry on the fracture behavior of lead-free solder joints;Nadimpalli;Eng Fract Mech,2011

5. Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling;Lin;Microelectron Reliab,2005

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Obtaining strain-rate dependent traction-separation law parameters of epoxy adhesive joints and predicting fracture for dissimilar bonding adherends;International Journal of Adhesion and Adhesives;2022-10

2. Main and interaction effects of manufacturing variables on microstructure and fracture of solder-copper connections;Engineering Failure Analysis;2022-09

3. Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly;Journal of Mechanical Engineering and Sciences;2022-03-23

4. Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies;Soldering & Surface Mount Technology;2021-07-22

5. Predicting Crack Initiation of Solder Joints with Varying Sizes Under Bending;Journal of Electronic Materials;2019-02-08

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