Effect of geometry on the fracture behavior of lead-free solder joints
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference25 articles.
1. A fracture mechanics approach to soldered joint cracking;Yamada;IEEE Trans Comp, Hybrids, Manuf Technol,1989
2. Fracture behavior of 63Sn–37Pb solder;Logsdon;Engng Fract Mech,1990
3. The effect of mechanical constraint on the flow and fracture of 63/37 Sn/Pb eutectic alloy;Skipor;Engng Fract Mech,1995
4. Mode I fracture toughness testing of eutectic Sn–Pb solder joints;Pratt;J Electron Mater,1994
5. Siow KS, Manoharan M. Combined tensile–shear fracture toughness of a lead–tin and tin–silver solder. In: IPC/SMTA electronics assembly expo; 1998. p. S19-13-1.
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of void and temperature on fracture of Cu/Cu3Sn bilayers: A molecular dynamics study;Materials Today Communications;2022-06
2. Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints;Journal of Electronic Packaging;2022-03-31
3. Geometry Influence on Fracture Behavior of Lap-Shear Solder Joints;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-01
4. Effect of bond-line thickness and mode-mixity on the fracture behavior and traction separation law of Sn-0.7Cu solder joints;Engineering Failure Analysis;2022-01
5. Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints;Microelectronics Reliability;2021-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3