Effects of void and temperature on fracture of Cu/Cu3Sn bilayers: A molecular dynamics study

Author:

Wu Cheng-Da,Liu Kai-Wei

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference29 articles.

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3. Nanowires of lead-free solder alloy SnCuAg;Atalay;J. Nanomater.,2011

4. Strain- and strainrate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation;Cheng;J. Mater. Sci.,2012

5. A nano-architectured porous electrode assembly of copper rich Cu6Sn5 film for rechargeable lithium batteries;Polat;J. Mater. Sci.,2013

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