Effects of Interface Structure on the Mechanical Properties and Deformation Mechanisms of Copper–Tantalum Interface via Molecular Dynamic Simulation-Reference-Cited by-同舟云学术

Effects of Interface Structure on the Mechanical Properties and Deformation Mechanisms of Copper–Tantalum Interface via Molecular Dynamic Simulation

Published:2024-01 Issue:1 Volume:14 Page:61-70
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Gao Zhongjie¹,Sheng Can¹,Wang Shizhao²^ORCID,Xue Lianghao²,Zhang Yunpeng¹,Liu Sheng¹^ORCID

Affiliation:

1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China

2. School of Power and Mechanical Engineering and the Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University, Wuhan, China

Funder

Fundamental Research Funds for the Central Universities

Major Program (JD) of Hubei Province

Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration

Jiangsu Province Engineering Research Center of Integrated Circuit Advanced Assembly and Test, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10452142/10384427.pdf?arnumber=10384427

Reference45 articles.

1. Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics

2. Heterogeneous Integration of CMOS Sensors and Fluidic Networks Using Wafer-Level Molding

3. TSV Technology and High-Energy Heavy Ions Radiation Impact Review

4. A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

5. Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation

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