Effects of location and size of Kirkendall voids on mechanical response of Cu/Sn solder joint under tension-Reference-Cited by-同舟云学术

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Effects of location and size of Kirkendall voids on mechanical response of Cu/Sn solder joint under tension

Published:2023-04-18 Issue:9 Volume:49 Page:885-892
ISSN:0892-7022
Container-title:Molecular Simulation
language:en
Short-container-title:Molecular Simulation

Author:

Wu Cheng-Da¹,Liu Kai-Wei¹

Affiliation:

1. Department of Mechanical Engineering, Chung Yuan Christian University, Taoyuan City, Taiwan

Funder

Ministry of Science and Technology, Taiwan

Publisher

Informa UK Limited

Subject

Condensed Matter Physics,General Materials Science,General Chemical Engineering,Modeling and Simulation,Information Systems,General Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1080/08927022.2023.2202754

Reference29 articles.

1. Materials, processing and reliability of low temperature bonding in 3D chip stacking

2. TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

3. Full intermetallic joints for chip stacking by using thermal gradient bonding

4. A review of mechanical properties of lead-free solders for electronic packaging

5. Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation

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1. Atomistic simulations of effects of nanostructure on bonding mechanism and mechanical response of direct bonding of (111)-oriented nanotwinned Cu;Journal of Applied Physics;2024-08-02

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