Comparison of solder joint fracture behavior in Arcan and DCB specimens
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference59 articles.
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5. R-curve behavior of Cu–Sn3. 0Ag0. 5Cu solder joints: effect of mode ratio and microstructure;Nadimpalli;Mater Sci Engng, A,2010
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