Effect of thermal treatment on fracture behavior of solder joints at various strain rates: Comparison of cyclic and constant temperature
Author:
Publisher
Elsevier BV
Subject
General Engineering,General Materials Science
Reference43 articles.
1. Fracture load prediction of lead-free solder joints;Nadimpalli;Eng. Fract. Mech.,2010
2. Mixed-mode fracture load prediction in lead-free solder joints;Nadimpalli;Eng. Fract. Mech.,2011
3. R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: effect of mode ratio and microstructure;Nadimpalli;Mater. Sci. Eng. A,2010
4. Die attach materials for high temperature applications: a review;Manikam;IEEE Trans. Components, Packag. Manuf. Technol.,2011
5. Survey of high-temperature reliability of power electronics packaging components;Khazaka;IEEE Trans. Power Electron.,2015
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