Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0Ag–0.5Cu ball grid array package-Reference-Cited by-同舟云学术

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Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0Ag–0.5Cu ball grid array package

Published:2023-07 Issue: Volume:98 Page:19-28
ISSN:1526-6125
Container-title:Journal of Manufacturing Processes
language:en
Short-container-title:Journal of Manufacturing Processes

Author:

Min Kyung Deuk,Ha Eun,Lee Sinyeob,Hwang Jae-Seon,Kang Taegyu,Joo Jinho,Jung Seung-Boo

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference31 articles.

1. The microstructure and mechanical property of the high entropy alloy as a low temperature solder;Pu,2019

2. Microstructure and shear behaviour of sn-3.0Ag-0.5Cu composite solder pastes enhanced by epoxy resin;Zhang;Polymers,2022

3. Low temperature solder - a breakthrough technology for surface mounted devices;Sahasrabudhe,2018

4. The effect of governmental policies of carbon taxes and energy-saving subsidies on enterprise decisions in a two-echelon supply chain;Yi;J Clean Prod,2018

5. Highly efficient soldering of sn-ag-cu solder joints using blue laser;Tatsumi;J Manuf Process,2022

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Preparation and characterization of Sn-3.0Ag-0.5Cu nano-solder paste and assessment of the reliability of joints fabricated by microwave hybrid heating;Materials Characterization;2024-01

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