Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling-Reference-Cited by-同舟云学术

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Published:2005-01 Issue:1 Volume:45 Page:143-154
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lin Y.C.,Chen X.,Liu Xingsheng,Lu Guo-Quan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference36 articles.

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5. Effect of substrate flexibility on solder joint reliability;Liu;Microelectron. Reliab.,2002

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