Thermal fatigue behaviors of Sn–4Ag/Cu solder joints at low strain amplitude
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference46 articles.
1. Lead-free Solders in Microelectronics
2. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
3. Rate of consumption of Cu in soldering accompanied by ripening
4. In situ observations on creep fatigue fracture behavior of Sn–4Ag/Cu solder joints
5. A Guide to Lead-free Solders: Physical Metallurgy Reliability,2007
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1. Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges;Journal of Electronic Materials;2024-03-08
2. Influences of original solder grain orientation on thermal fatigue damage and microstructure evolution of the SnAgCu/Cu solder joints revealed by in-situ characterization;Journal of Materials Science: Materials in Electronics;2024-02
3. High-Temperature Thermal–Electrical Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints;Journal of Electronic Materials;2023-04-05
4. Manufacturing and characterization of Sn–Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process;Journal of Materials Science: Materials in Electronics;2022-05-16
5. Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2020-04-28
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