Cooling future system-on-chips with diamond inter-tiers-Reference-Cited by-同舟云学术

Cooling future system-on-chips with diamond inter-tiers

Published:2023-12 Issue:12 Volume:4 Page:101686
ISSN:2666-3864
Container-title:Cell Reports Physical Science
language:en
Short-container-title:Cell Reports Physical Science

Author:

Malakoutian Mohamadali^ORCID,Kasperovich Anna,Rich Dennis,Woo Kelly,Perez Christopher,Soman Rohith,Saraswat Devansh,Kim Jeong-kyu,Noshin Maliha,Chen Michelle,Vaziri Sam,Bao Xinyu,Shih Che Chi,Woon Wei-Yen,Asheghi Mehdi,Goodson Kenneth E.,Liao Szuya Sandy,Mitra Subhasish,Chowdhury Srabanti

Publisher

Elsevier BV

Subject

General Physics and Astronomy,General Energy,General Engineering,General Materials Science,General Chemistry

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