Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Developing lead-free solders: A challenge and opportunity
2. Issues in the replacement of lead-bearing solders
3. Converting to lead-free solders: An automotive industry perspective
4. The effect of reflow process variables on the wettability of lead-free solders
5. Progress in the design of new lead-free solder alloys
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