Author:
McCormack Mark,Jin Sungho
Publisher
Springer Science and Business Media LLC
Subject
General Engineering,General Materials Science
Reference11 articles.
1. M. McCormack et al., Appl. Phys. Lett. (in press).
2. M. McCormack, S. Jin, and G.W. Kammlott, IEEE Trans. CHMT (to be published).
3. M. McCormack et al. (unpublished).
4. P.T. Vianco and D.R. Frear, “Issues in the Replacement of Lead-Bearing Solders,” JOM, 45 (7) (1993), pp. 14–19.
5. C. Melton, “The Effect of Reflow Process Variables on the Wettability of Lead-Free Solders,” JOM, 45(7) (1993), pp. 33–35.
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