Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology
Author:
Publisher
Elsevier BV
Subject
Hardware and Architecture,Modelling and Simulation,Software
Reference32 articles.
1. Application of Taguchi Method on the robust design of molded 225 plastic ball grid array packages;Mertol;IEEE Transactions on Components, Packaging, and Manufacturing Technology- Part B,1995
2. Using neural networks and immune algorithms to find the optimal parameters for an IC wire bonding process;Hou;Expert System with Applications,2008
3. Combing radial basis function neural network and genetic algorithm to improve HDD driver IC chip scale package assembly yield;Huang;Expert Systems with Applications,2008
4. Optimization of TQFP molding process using neuro-fuzzy-GA approach;Chiang;European Journal of Operational Research,2003
5. Advanced structural similarity rules for the BGA package family;van Driel;Microelectronics Reliability,2007
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