Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process

Abstract

Purpose This paper aims to study the filling progression of underfill flow and void formation during the flip-chip encapsulation process. Design/methodology/approach A new parameter of filling progression that relates volume fraction filled to filling displacement was formulated analytically. Another indicative parameter of filling efficiency was also introduced to quantify the voiding fraction in filling progression. Additionally, the underfill process on different flip-chips based on the past experiments was numerically simulated. Findings All findings were well-validated with reference to the past experimental results, in terms of quantitative filling progression and qualitative flow profiles. The volume fraction filled increases monotonically with the filling displacement and thus the filling time. As the underfill fluid advances, the size of the void decreases while the filling efficiency increases. Furthermore, the void formed during the underfilling flow stage was caused by the accelerated contact line jump at the bump entrance. Practical implications The filling progression enabled manufacturers to forecast the underfill flow front, as it advances through the flip-chip. Moreover, filling progression and filling efficiency could provide quantitative insights for the determination of void formations at any filling stages. The voiding formation mechanism enables the prompt formulation of countermeasures. Originality/value Both the filling progression and filling efficiency are new indicative parameters in quantifying the performance of the filling process while considering the reliability defects such as incomplete filling and voiding.