Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA-Reference-Cited by-同舟云学术

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Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA

Published:2018-04 Issue:4 Volume:43 Page:
ISSN:0256-2499
Container-title:Sādhanā
language:en
Short-container-title:Sādhanā

Author:

ABAS AIZAT,NG FEI CHONG,GAN Z L,ISHAK M H H,ABDULLAH M Z,CHONG GEAN YUEN

Funder

Division of Research and Innovation, Universiti Sains Malaysia

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Link

http://link.springer.com/article/10.1007/s12046-018-0849-3/fulltext.html

Reference21 articles.

1. Ardebili H and Pecht M G 2009 Encapsulation process technology. In: Encapsulation Technologies for Electronic Applications, chapter 3. Elsevier, Amsterdam, Netherlands, pp. 129–179

2. Zhang Z and Wong C P 2004 Recent advances in flip-chip underfill: materials, process, and reliability. IEEE Trans. Adv. Packag. 27(3): 515–524

3. Chong N F, Aizat A, Ishak M H H, Abdullah M Z and Abdul Aziz M S 2016 Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. Microelectron. Reliab. 66: 143–160

4. Wan J W, Zhang W J and Bergstrom D J 2007 Recent advances in modeling the underfill process in flip-chip packaging. Microelectron. J. 38: 67–75

5. Wan J W, Zhang W J and Bergstrom D J 2008 Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging. Microelectron. Reliab. 48: 425–430

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4. Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process;Soldering & Surface Mount Technology;2023-08-03

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