Author:
van Driel W.D.,Mavinkurve A.,van Gils M.A.J.,Zhang G.Q.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Gilleo K, Solberg V. No place to go but up, Semicond Int 1, 2001.
2. van Driel WD, Janssen JHJ, van Silfhout RBR, van Gils MAJ, Zhang GQ, Ernst LJ. On wire failures in micro-electronic packages. In: Proceedings EuroSimE Conference; 2004. p. 53–8.
3. Influence of material combinations on delamination failures in a cavity down TBGA package;van Driel;IEEE Trans Comp Pack,2004
4. Packaging induced die stresses – Effect of chip anisotropy and time-dependent behaviour of a moulding compound;van Driel;J Electron Pack,2003
5. Prediction and verification of process induced warpage of electronic packages;van Driel;J Microelectron Reliab,2003
Cited by
12 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献