Author:
van Driel W.D.,Wisse G.,Chang A.Y.L.,Janssen J.H.J.,Fan X.J.,Zhang K.G.Q.,Ernst L.J.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
14 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Robust Package Study for A Power Package by Simulation;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19
2. Reliability Analysis of Group III Nitride LEDs Devices;Springer Series in Materials Science;2020
3. Study of V-groove on Leadframe/Epoxy Mold Compound Delamination Improvement;2019 20th International Conference on Electronic Packaging Technology(ICEPT);2019-08
4. Heterogeneous Integration of Memory Stacks;Heterogeneous Integrations;2019
5. Finite-Element Analysis and Experimental Test for a Capped-Die Flip-Chip Package Design;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-09