Author:
Fan Haibo,Wong Hugo,Wong Fei,Zhang Kai,Chen Haibin
Cited by
3 articles.
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1. Assessment of Delamination Risk During the Package Sawing Process by Simulation;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Delamination Improvement for High Voltage Power Devices;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
3. Design Selection and Optimization of Mechanical Anchoring Structure on Pre-plated Cu Leadframes;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07