Simulation-based optimization of plastic transfer molding parameter for thin small outline package via response surface methodology
Author:
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00170-023-12923-8.pdf
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5. Ishak MHH, Abdullah MZ, Abas A (2016) Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process. Microelectron Reliab 65:205–216
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