Failure Analysis of Plastic Packages for Low-Power ICs
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-55071-8_21
Reference8 articles.
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3. Wu, H., Liu, L., Chen, X., Kuang, X., Lei, D.: Failure analysis and case study of plastic encapsulated microelectronics. In: International Conference on Reliability, Maintainability and Safety (ICRMS) (2014)
4. STMicroelectronics: Soldering recommendation and package information for lead-free ECOPACK microcontrollers (2016)
5. Saponara, S., Petri, E., Fanucci, L., Terreni, P.: Sensor modeling, low-complexity fusion algorithms, and mixed-signal IC prototyping for gas measures in low-emission vehicles. IEEE Trans. Instrum. Meas. 60(2), 372–384 (2011)
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