Diode laser soldering using a lead-free filler material for electronic packaging structures-Reference-Cited by-同舟云学术

Diode laser soldering using a lead-free filler material for electronic packaging structures

Published:2006-04 Issue:13 Volume:252 Page:4406-4410
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Chaminade C.,Fogarassy E.,Boisselier D.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference21 articles.

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3. Applications of high-power lasers in electronic assembly;Flanagan;Key Eng. Mater.,1996

4. A.P. Hoult, A.J. McLenaghan, J. Rathod, Advances in laser soldering using high power diode lasers, Speedline Technology White Paper, http://www.speedlinetech.com.

5. A. Leutzinger, Selecting laser selective soldering, Industrial Laser Solutions, February 2004. http://ils.pennnet.com.

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