Effect of Sn-xCu Solder Alloy onto Intermetallic Formation After Laser Soldering
Author:
Publisher
Springer Nature Singapore
Link
https://link.springer.com/content/pdf/10.1007/978-981-19-1457-7_67
Reference28 articles.
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3. Ma H, Suhling JC (2009) A review of mechanical properties of lead-free solders for electronic packaging. J Mater Sci 44(5):1141–1158. https://doi.org/10.1007/s10853-008-3125-9
4. Yoon J-W, Jung S-B (2005) Interfacial reactions between Sn–0.4Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction. J Alloys Compd 396(1):122–127. https://doi.org/10.1016/j.jallcom.2004.12.009
5. Shohji I, Yoshida T, Takahashi T, Hioki S (2004) Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity. Mater Sci Eng A 366:50–55. https://doi.org/10.1016/j.msea.2003.09.057
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