Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods-Reference-Cited by-同舟云学术

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Effect of surface oxide on the melting behavior of lead-free solder nanowires and nanorods

Published:2012-07 Issue:19 Volume:258 Page:7507-7514
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Gao Fan,Rajathurai Karunaharan,Cui Qingzhou,Zhou Guangwen,NkengforAcha Irene,Gu Zhiyong

Funder

NSF Center for High-rate Nanomanufacturing

3M Company

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference30 articles.

1. Cold welding of ultrathin gold nanowires;Lu;Nature Nanotechnology,2010

2. The bonding of nanowire assemblies using adhesive and solder;Gu;JOM,2005

3. Wetting properties of tin/silver alloy nanoparticles for low melting point lead-free solders;Jiang;Chemistry of Materials,2007

4. Interconnect formation of nanowires and carbon nanotubes for nanoelectronics and nanosystems;Cui;Small,2009

5. Reflow and electrical characteristics of nanoscale solder;Gu;Small,2006

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3. Understanding the corrosion protection effect by surface oxide film to underlying Sn solder substrate under thermal exposure condition;Corrosion Science;2024-04

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