Native oxide film powered corrosion protection of underlying Pb-free Sn solder substrate

Author:

Qiao Chuang,Wu Qiong,Hao Long,Wang Youzhi,Sun Xu,Zou Qingchuan,An Xizhong

Funder

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

General Materials Science,General Chemical Engineering,General Chemistry

Reference48 articles.

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2. Development of lead-free interconnection materials in electronic industry during the past decades: structure and properties;Zhong;Mater. Des.,2022

3. Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review;Li;Mater. Des.,2021

4. Thermal aging effects on microstructure, elastic property and damping characteristic of a eutectic Sn-3.5Ag solder;Gain;J. Mater. Sci.: Mater. Electron.,2018

5. A critical review on performance, microstructure and corrosion resistance of Pb-free solders;Fazal;Measurement,2019

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