Effect of composition on electroless deposited Ni–Co–P alloy thin films as a diffusion barrier for copper metallization-Reference-Cited by-同舟云学术

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Effect of composition on electroless deposited Ni–Co–P alloy thin films as a diffusion barrier for copper metallization

Published:2012-08 Issue:20 Volume:258 Page:7962-7967
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Kumar Anuj,Kumar Mukesh,Kumar Dinesh

Funder

Department of Science and Technology, Ministry of Science, India

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference38 articles.

1. Damascene copper electroplating for chip interconnections

2. Copper Transport in Thermal SiO2

3. Diffusion of copper through dielectric films under bias temperature stress

4. Copper deposition and thermal stability issues in copper-based metallization for ULSI technology

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1. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock;Materials & Design;2022-12

2. Dynamic substrate reactions during room temperature heavy ion irradiation of CoCrCuFeNi high entropy alloy thin films;npj Materials Degradation;2022-07-20

3. High-entropy ceramics: Review of principles, production and applications;Materials Science and Engineering: R: Reports;2021-10

4. The effect of CFO nanoparticles on magnetic and erosion-corrosion behavior of CFO@Ni-P nanocomposite coating;Advanced Powder Technology;2020-02

5. Thermal stability of AlCrTaTiZrMo-nitride high entropy film as a diffusion barrier for Cu metallization;Journal of Alloys and Compounds;2019-01

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