Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock-Reference-Cited by-同舟云学术

Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock

Published:2022-12 Issue: Volume:224 Page:111389
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Liu Yang,Chen Chuantong,Zhang Zheng,Ueshima Minoru,Sakamoto Takeshi,Naoe Takuya,Nishikawa Hiroshi,Oda Yukinori,Suganuma Katsuaki

Funder

Japan Society for the Promotion of Science

New Energy and Industrial Technology Development Organization

Murata Science Foundation

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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