Characterizing SIMS transient effects apparent in matrix secondary ion signals from silicon under 1keV Cs+ impact
Author:
Publisher
Elsevier BV
Subject
Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry
Reference5 articles.
1. Sputtering by Particle Bombardment. Part III;Yu,1991
2. Transient effects in ultra shallow depth profiling of silicon by secondary ion mass spectrometry
3. Secondary ion formation/survival during the initial stages of sputtering Si and SiO2 with Cs+
4. A systematic study of the surface roughening and sputter rate variations occurring during SIMS ultrashallow depth profile analysis of Si with Cs+
5. Film thickness measurements of SiO2 by XPS
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2. Storing matter technique performed in the analytical chamber of a quadrupole SIMS analyser;Surface and Interface Analysis;2014-09-30
3. Oxidation effect on the SIMS analysis of samples sputtered and deposited by the Storing Matter technique;Applied Surface Science;2012-05
4. Application of the storing matter technique to the analysis of boron doped and implanted SiO2/Si;Applied Surface Science;2012-03
5. Grazing incidence x-ray fluorescence and secondary ion mass spectrometry combined approach for the characterization of ultrashallow arsenic distribution in silicon;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2010-01
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