Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process-Reference-Cited by-同舟云学术

Elimination of surface scratch/texture on the surface of single crystal Si substrate in chemo-mechanical grinding (CMG) process

Published:2009-01 Issue:7 Volume:255 Page:4205-4211
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Tian Y.B.,Zhou L.,Shimizu J.,Tashiro Y.,Kang R.K.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference19 articles.

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4. Fabrication and evaluation for extremely thin Si wafer;Zhou;International Journal of Abrasive Technology,2007

5. Present status of research and application in ultra-precision grinding technology of large-scale silicon wafer;Kang;Diamond and Abrasives Engineering,2003

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