Fabrication and evaluation for extremely thin Si wafer-Reference-Cited by-同舟云学术

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Fabrication and evaluation for extremely thin Si wafer

Published:2007 Issue:1 Volume:1 Page:94
ISSN:1752-2641
Container-title:International Journal of Abrasive Technology
language:en
Short-container-title:IJAT

Author:

Zhou Libo,Hosseini Bahman Soltani,Tsuruga Tatsuya,Shimizu Jun,Eda Hiroshi,Kamiya Sumio,Iwase Hisao,Tashiro Yoshiaki

Publisher

Inderscience Publishers

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications;Microelectronics International;2023-04-26

2. Non-contact grinding/thinning of silicon carbide wafer by pure EDM using a rotary cup wheel electrode;Precision Engineering;2022-03

3. Stress analysis in new improved differential vertical comb capacitive micro accelerometer using SOI technology;Microsystem Technologies;2021-01-03

4. Evolution of mechanically formed bow due to surface waviness and residual stress difference on sapphire (0001) substrate;Journal of Materials Processing Technology;2019-07

5. Investigation into the Realization of a Single Atomic Layer Removal in Nanoscale Mechanical Machining of Single Crystalline Copper;Springer Tracts in Mechanical Engineering;2018-12-31

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