Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications

Abstract

Purpose The aim of this study is to make a contribution towards reducing the deflections of silicon wafers. The deformation of silicon wafers used in the manufacture of electronic micro-components is one of the most common problems encountered by industrialists during manufacturing. Stack warping is typically produced during the process of depositing thin layers on a substrate. This is due to the thermal-mechanical stresses caused by the difference between the thermal expansion coefficients of the materials. Reducing wafer deformation is essential to increase reliability and improve quality. In this paper, the authors propose an approach based on minimal geometrical modifications to reduce the deformation of a silicon wafer coated with two thin layers. Numerical finite element models have been developed to evaluate the impact of geometrical modifications on warping amplitude. Finite element models have been validated compared with experimental models. The results obtained are encouraging and clearly show a considerable reduction in wafer deformation. Design/methodology/approach Reducing wafer deformation is essential to increase reliability and improve quality. In this paper, the authors propose an approach based on minimal geometrical modifications to reduce the deformation of a silicon wafer coated with two thin layers. Numerical finite element models have been developed to evaluate the impact of geometrical modifications on warping amplitude. Finite element models have been validated compared with experimental models. Findings The results obtained are encouraging and clearly show a considerable reduction in wafer deformation. Originality/value This paper describes the influence of geometric modification on wafer deformation. The work show also the cruciality of stress reduction in the purpose to obtain less wafer deformation.