Fine grinding of silicon wafers-Reference-Cited by-同舟云学术

Fine grinding of silicon wafers

Published:2001-04 Issue:5 Volume:41 Page:659-672
ISSN:0890-6955
Container-title:International Journal of Machine Tools and Manufacture
language:en
Short-container-title:International Journal of Machine Tools and Manufacture

Author:

Pei Z.J,Strasbaugh Alan

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering

Reference16 articles.

1. Silicon: the conflict between price and perfection;Rose;Channel Magazine,1998

2. Fracture strength of large diameter silicon wafers;Bawa;Semiconductor International,1995

3. T. Fukami, H. Masumura, K. Suzuki, H. Kudo, Method of manufacturing semiconductor mirror wafers, European Patent Application, EP0782179A2, Bulletin 1997/27.

4. Abrasive machining of silicon;Tonshoff;Annals of CIRP,1990

5. Overview of abrasive finishing processes in the electronics industry;Tricard;Abrasives Magazine,1998

Cited by 91 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pressure Distribution and Wear of Grinding Wheel in Ultra-Thinning Process of LiTaO3 Wafer;International Journal of Precision Engineering and Manufacturing;2024-08-18

2. The use of Preston equation to determine material removal during lap-grinding with electroplated CBN tools;Wear;2023-09

3. Deep insights into interaction behaviour and material removal of β-SiC wafer in nanoscale polishing;Tribology International;2023-08

4. Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface;Microelectronics Reliability;2022-12

5. A novel dry processing technique to construct a high-performance superfine diamond grinding wheel with thermal and material characterizations;Journal of Manufacturing Processes;2022-10