Modelling the Elastic Energy of a Bifurcated Wafer: a Benchmark of the Analytical Solution vs. The ANSYS Finite Element Analysis-Reference-Cited by-同舟云学术

Modelling the Elastic Energy of a Bifurcated Wafer: a Benchmark of the Analytical Solution vs. The ANSYS Finite Element Analysis

Published:2022-02 Issue: Volume:281 Page:114996
ISSN:0263-8223
Container-title:Composite Structures
language:en
Short-container-title:Composite Structures

Author:

Vinciguerra Vincenzo,Malgioglio Giuseppe Luigi,Landi Antonio

Publisher

Elsevier BV

Subject

Civil and Structural Engineering,Ceramics and Composites

Reference40 articles.

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5. Sitta A, Landi A, Cafra B, Renna M, Calabretta M. Analysis of warpage behavior of electrochemical deposited thick copper on silicon, in “ PCIM Europe digital days 2020; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2020., 2020.

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