Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Subject
Metals and Alloys,Polymers and Plastics,Surfaces, Coatings and Films,Biomaterials,Electronic, Optical and Magnetic Materials
Cited by
6 articles.
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1. Models of Bifurcation and Gravity Induced Deflection in Wide Band Gap 4H-SiC Semiconductor Wafers;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
2. The surface residual stress of monocrystalline silicon in ultrasonic vibration–assisted diamond wire sawing;The International Journal of Advanced Manufacturing Technology;2022-06-16
3. Wafer Bifurcation as a Spontaneous Symmetry Breaking;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
4. From Wafer Bifurcation to Warpage Die: a Correlation Method to determine the Warpage of a Metal-Coated Silicon Substrate;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
5. Models of Bifurcation in a Semiconductor Wafer: A Comparison of the Analytical Solution vs. the ANSYS Finite Element Analysis;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25