Finite Element Analysis of the Upsurge of Bifurcation during the Thinning Process of Large Semiconductor Wafers-Reference-Cited by-同舟云学术

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Finite Element Analysis of the Upsurge of Bifurcation during the Thinning Process of Large Semiconductor Wafers

Published:2024-04-07 Issue: Volume: Page:1-4
ISSN:
Container-title:2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Vinciguerra Vincenzo¹,Malgioglio Giuseppe Luigi¹,Renna Marco¹

Affiliation:

1. STMicroelectronics Catania, Stradale Primosole 50,Quality, Manufacturing and Technology (QMT) – Power & Discrete Technologies R&D Department,Catania,Italy,95121

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491572.pdf?arnumber=10491572

Reference14 articles.

1. Deflection Shapes Due to Intrinsic Stress in Thin Films

2. Geometrically nonlinear stress-deflection relations for thin film/substrate systems

3. Analysis of Asymmetric Warpage of Thin Wafers on Flat Plate Considering Bifurcation and Gravitational Force

4. Thin Film Materials: Stress;Fruend;Defect Formation and Surface Evolution,2004

5. Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Element Analysis

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