Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology-Reference-Cited by-同舟云学术

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Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology

Published:2008-08 Issue:4 Volume:18 Page:814-818
ISSN:1003-6326
Container-title:Transactions of Nonferrous Metals Society of China
language:en
Short-container-title:Transactions of Nonferrous Metals Society of China

Author:

HAN Zong-jie,XUE Song-bai,WANG Jian-xin,ZHANG Xin,ZHANG Liang,YU Sheng-lin,WANG Hui

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics

Reference18 articles.

1. Practical surface mount technology [M];ZHANG,2007

2. A surface-mounted device assembly technique for small optics based on laser reflow soldering [J];STAUFFER;Optics and Lasers in Engineering,2005

3. Effect of diode-laser parameters on shear force of micro-joints soldered with Sn-Ag-Cu lead-free solder on Au/Ni/Cu pad [J];WANG;Trans Nonferrous Met Soc China,2006

4. Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion Au surface finish after reflow soldering [J];SUN;Materials Science and Engineering B,2006

5. Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder [J];ARULVANAN;Microelectronic Engineering,2006

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1. Exceptional load-bearing capability of Al FPCB/Cu FPCB lap joints using instantaneous laser-based large area facial soldering: Experimental and numerical investigations;Journal of Materials Research and Technology;2024-05

2. Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock;Coatings;2023-03-07

3. Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint;Materials & Design;2022-03

4. 激光微纳连接技术研究进展;Laser & Optoelectronics Progress;2022

5. The degradation study for QFP interconnection structure based on PCMD health index and Darveaux model;Microelectronics Reliability;2020-06

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