Author:
Stauffer L.,Würsch A.,Gächter B.,Siercks K.,Verettas I.,Rossopoulos S.,Clavel R.
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Mickelson AR, Basavanhally NC, Lee YC. Optoelectronic packaging. Wiley; New York: 1997.
2. Scussat M, Würsch A. An innovative flexible and accurate packaging technique suited to fabricate low cost micro optoelectronic modules. 50th ECTC Conference, Las Vegas, USA, Mai 2000.
3. Würsch A, Scussat M. An innovative micro optical elements assembly robot characterized by high accuracy and flexibility. 50th ECTC Conference, Las Vegas, USA, Mai 2000.
4. see TRIMO web site www.leica-geosystems.com/trimo-smd.
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