An innovative flexible and accurate packaging technique suited to fabricate low cost micro optoelectronic modules

Author:

Scussat M.,Wursch A.,Clavel R.,Salathe R.P.

Publisher

IEEE

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. A surface-mounted device assembly technique for small optics based on laser reflow soldering;Optics and Lasers in Engineering;2005-03

2. Automated opto-electronic packaging for 10 Gb/s applications;2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

3. Automated opto-electronic packaging for 10 Gb/s transponders;52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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