Automated opto-electronic packaging for 10 Gb/s transponders-Reference-Cited by-同舟云学术

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Automated opto-electronic packaging for 10 Gb/s transponders

Published: Issue: Volume: Page:
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Container-title:52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)
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Author:

Verdiell J.-M.,Kohler R.,Epitaux M.,Finot M.,Kirkpatrick P.,Lake R.,Colin S.,Mader T.,Bennett J.,Yao J.,Zbinden E.,Buchheit S.,Walker J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7890/21740/01008192.pdf?arnumber=1008192

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Compact, efficient ultra-wide tunable laser with reduced thermal crosstalk;Optics Express;2024-09-03

2. Packaging Multiple Active and Passive Elements in a Hybrid Optical Platform;Journal of Lightwave Technology;2004-05

3. Thermally tuned external cavity laser with micromachined silicon etalons: design, process and reliability;2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546)

4. Process development for 10 Gb/s small footprint butterfly transmitter;53rd Electronic Components and Technology Conference, 2003. Proceedings.

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