Author:
Longteng Li,Bo Jing,Jiaxing Hu
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference44 articles.
1. Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress;Liu;J. Mater. Sci. Mater. Electron.,2016
2. Reliability of Lead-Free Electronic Package Interconnections under Harsh Environment;Hai,2014
3. A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products;Shnawah;Microelectron. Reliab.,2012
4. Reliability behavior of lead-free solder joints in electronic components;Zhang;J. Mater. Sci. Mater. Electron.,2013
5. Packaging Technologies for Electronic Devices. High-Speed Digital System Design;Belous,2020
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献