Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference16 articles.
1. In search of new lead-free electronic solders[J];WOOD;Journal of Electronic Materials,1994
2. Lead-free reflow soldering for electronics assembly[J];HARRISON;Soldering & Surface Mount Technology,2001
3. Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements[J];GADAG;Journal of Electronic Materials,2000
4. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu[J];LEE;Journal of Materials Research,2002
5. Pb-free solders for flip-chip interconnects[J];FREAR;Journal of Metals,2001
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