Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements-Reference-Cited by-同舟云学术

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Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements

Published:2000-12 Issue:12 Volume:29 Page:1392-1397
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Gadag Shiva P.,Patra Susant

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-000-0124-2.pdf

Reference20 articles.

1. C.J. Thwaites, W.B. Hampshire, Welding Res. Sup. 323 (1976).

2. W.J. Plumbridge, J. Mater. Sci. 31, 2501 (1996).

3. M. Ohring, Reliability and Failure of Electronic Materials and Devices (San Diego, CA: Academic Press, 1998).

4. P.T. Vianco, ASM Handbook (Materials Park, OH: ASM, pp. 964–984.

5. K. Kawashima, T. Ito, and M. Sakuragi, J. Mater Sci. 27, 6387 (1992).

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