Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD)
Author:
Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-26708-6_5
Reference51 articles.
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3. Chen WT, Ho CE, Kao CR (2002) Effect of Cu concentration on the interfacial reactions between Ni and Sn–Cu solders. J Mater Res 17:263–266
4. Tu PL, Chan YC, Hung KC, Lai JKL (2001) Growth kinetics of intermetallic compounds in chip scale package solder joint. Scripta Mater 44:317–323
5. Burke J (1972) The Kinetics of phase transformations in metals. English edition (trans: Hirano K, Hori H) pp 190–193
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