Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach

Author:

Otiaba Kenny C.,Bhatti R.S.,Ekere N.N.,Mallik S.,Ekpu M.

Publisher

Elsevier BV

Subject

General Engineering,General Materials Science

Reference48 articles.

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5. Temperature cycling reliability of high-temperature lead-free die-attach technologies;Quintero;IEEE Trans Dev Mater Reliab,2011

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