Comparison of thermal-fatigue lives of conventional and hybrid solder joints: Experiment and FE analysis

Author:

Park Geun-Je,Jang Dong-Min,Jang Jin-WooORCID,Jang Jae-Seok,Jeong Jae-YoonORCID,Kim Yun-Jae

Funder

Samsung

Publisher

Elsevier BV

Subject

General Engineering,General Materials Science

Reference47 articles.

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2. J. Huisman, F. Magalini, R. Kuehr, C. Maurer, S. Ogilvie, J. Poll, C. Delgado, E. Artim, J. Szlezak, A. Stevels, 2008 review of directive 2002/96 on waste electrical and electronic equipment (WEEE), (2007).

3. Solder Joint Technology;Tu,2007

4. Low-temperature solders;Mei;Hewlett Packard J.,1996

5. Low temperature solder - a breakthrough technology for surface mounted devices;Sahasrabudhe,2018

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