Reliability Prediction and Improvement of Board-Level Thermal Cycling Test for Molded Flip-Chip Ball-Grid-Array Package-Reference-Cited by-同舟云学术

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Reliability Prediction and Improvement of Board-Level Thermal Cycling Test for Molded Flip-Chip Ball-Grid-Array Package

Published:2023-12-05 Issue: Volume: Page:995-998
ISSN:
Container-title:2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
language:
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Author:

Chen Dao-Long¹,Chen Tang-Yuan¹,Lai Wei-Hong¹,Yin Wei-Jie¹,Kuo Chun-Liang²,Ko Chun-Yu²,Cheng Chi-Min²

Affiliation:

1. Advanced Semiconductor Engineering, Inc.,Product Characterization,ROC

2. Advanced Semiconductor Engineering, Inc.,Quality Assurance Laboratory,ROC

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10457288/10457581/10457878.pdf?arnumber=10457878

Reference18 articles.

1. Accelerated moisture resistance - unbiased autoclave;JESD22-A102E,2015

2. Temperature cycling;JESD22-A104F,2023

3. High temperature storage life;JESD22-A103E,2021

4. Highly accelerated temperature and humidity stress test (HAST);JESD22-A110E,2021

5. Accelerated moisture resistance - unbiased HAST;JESD22-A118B,2021

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