Low-temperature interconnection and strengthening mechanism of Cu/Cu joint with SAC particles solders
-
Published:2023-07
Issue:
Volume:4
Page:100026
-
ISSN:2773-0646
-
Container-title:Memories - Materials, Devices, Circuits and Systems
-
language:en
-
Short-container-title:Memories - Materials, Devices, Circuits and Systems
Author:
Gan Gui-sheng,
Huang Tian,
Chen Shi-qi,
Jiang Liu-jie,
Cheng Da-yong,
Zhang Shu-yeORCID
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献