Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time-Reference-Cited by-同舟云学术

Spreading Behaviour and Joint Reliability of Sn–0.3Ag–0.7Cu Lead-Free Solder Alloy on Nickel Coated Copper Substrate as a Function of Reflow Time

Published:2015-09-11 Issue:6 Volume:68 Page:1027-1031
ISSN:0972-2815
Container-title:Transactions of the Indian Institute of Metals
language:en
Short-container-title:Trans Indian Inst Met

Author:

Sona Mrunali,Narayan Prabhu K.

Funder

Defence Research and Development Organisation (IN)

Publisher

Springer Science and Business Media LLC

Link

http://link.springer.com/content/pdf/10.1007/s12666-015-0640-7.pdf

Reference11 articles.

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2. Harcuba P, and Janecek M, in WDS’ 08 Proceeding of Contributed Papers, part III (2008), p 220 ISBN 978-80-7378-067-8.

3. Daly A A E, and Taher A M E, Mater Des 51 (2013) 789.

4. Mookam N, and Kanlayasiri K, J Alloys Compd 509 (2011) 6276.

5. Information on http://alpha.alent.com/media/Files/CooksonElectronics/Effect%20of%20silver%20in%20common%20leadfree%20alloyspaperEng042309 . Accessed 25 June 2015.

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